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MOSFET and method for manufacturing the same

  • 申请号:US201113510461
  • 专利类型:US
  • 申请(专利权)人:中国科学院微电子研究所
  • 公开(公开)号:US9252280(B2)
  • 公开(公开)日:2016.02.02
  • 法律状态:
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专利详情

专利名称 MOSFET and method for manufacturing the same
申请号 US201113510461 专利类型 US
公开(公告)号 US9252280(B2) 公开(授权)日 2016.02.02
申请(专利权)人 中国科学院微电子研究所 发明(设计)人 Zhu Huilong;Xu Miao;Liang Qingqing
主分类号 H01L27/12 IPC主分类号 H01L27/12;H01L29/786;H01L29/66
专利有效期 MOSFET and method for manufacturing the same 至MOSFET and method for manufacturing the same 法律状态
说明书摘要 The present disclosure discloses a metal-oxide-semiconductor field-effect transistor (MOSFET) and a method for manufacturing the same. The MOSFET includes: a silicon on insulator (SOI) wafer which comprises a semiconductor substrate, a buried insulating layer, and a semiconductor layer, the buried insulating layer being on the semiconductor substrate, and the semiconductor layer being on the buried insulating layer; a gate stack on the semiconductor layer; a source region and a drain region, which are in the semiconductor layer and on opposite sides of the gate stack; and a channel region, which is in the semiconductor layer and sandwiched by the source region and the drain region, wherein the MOSFET further comprises a back gate, the back gate being located in the semiconductor substrate and having a first doped region in a lower portion of the back gate and a second doped region in an upper portion of the back gate.

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