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Semiconductor device and method for manufacturing the same

  • 申请号:US201514696616
  • 专利类型:US
  • 申请(专利权)人:中国科学院微电子研究所
  • 公开(公开)号:US9431504(B2)
  • 公开(公开)日:2016.08.30
  • 法律状态:
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专利详情

专利名称 Semiconductor device and method for manufacturing the same
申请号 US201514696616 专利类型 US
公开(公告)号 US9431504(B2) 公开(授权)日 2016.08.30
申请(专利权)人 中国科学院微电子研究所 发明(设计)人 Yin Huaxiang;Zhang Yongkui;Zhao Zhiguo;Lu Zhiyong;Zhu Huilong
主分类号 H01L29/49 IPC主分类号 H01L29/49;H01L29/10;H01L29/66;H01L21/8234;H01L27/088;H01L21/265
专利有效期 Semiconductor device and method for manufacturing the same 至Semiconductor device and method for manufacturing the same 法律状态
说明书摘要 A semiconductor device is provided that has a plurality of Fin structures extending on a substrate along a first direction; a gate stack structure extending on the substrate along a second direction and across the plurality of Fin structures, wherein the gate stack structure comprises a gate conductive layer and a gate insulating layer, and the gate conductive layer is formed by a doped poly-semiconductor; trench regions in the plurality of Fin structures and beneath the gate stack structure; and source/drain regions on the plurality of Fin structures and at both sides of the gate stack structure along the first direction. A method of manufacturing a semiconductor device is also provided.

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