Semiconductor device and method for manufacturing the same
- 申请号:US201514696616
- 专利类型:US
- 申请(专利权)人:中国科学院微电子研究所
- 公开(公开)号:US9431504(B2)
- 公开(公开)日:2016.08.30
- 法律状态:
- 出售价格: 面议 立即咨询
专利详情
专利名称 | Semiconductor device and method for manufacturing the same | ||
申请号 | US201514696616 | 专利类型 | US |
公开(公告)号 | US9431504(B2) | 公开(授权)日 | 2016.08.30 |
申请(专利权)人 | 中国科学院微电子研究所 | 发明(设计)人 | Yin Huaxiang;Zhang Yongkui;Zhao Zhiguo;Lu Zhiyong;Zhu Huilong |
主分类号 | H01L29/49 | IPC主分类号 | H01L29/49;H01L29/10;H01L29/66;H01L21/8234;H01L27/088;H01L21/265 |
专利有效期 | Semiconductor device and method for manufacturing the same 至Semiconductor device and method for manufacturing the same | 法律状态 | |
说明书摘要 | A semiconductor device is provided that has a plurality of Fin structures extending on a substrate along a first direction; a gate stack structure extending on the substrate along a second direction and across the plurality of Fin structures, wherein the gate stack structure comprises a gate conductive layer and a gate insulating layer, and the gate conductive layer is formed by a doped poly-semiconductor; trench regions in the plurality of Fin structures and beneath the gate stack structure; and source/drain regions on the plurality of Fin structures and at both sides of the gate stack structure along the first direction. A method of manufacturing a semiconductor device is also provided. |
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