专利详情

专利名称	Packaging structure of light emitting diode and method of manufacturing the same
申请号	US201214232443	专利类型	US
公开（公告）号	US9246052(B2)	公开（授权）日	2016.01.26
申请（专利权）人	中国科学院半导体研究所	发明（设计）人	Li Jinmin;Yang Hua;Yi Xiaoyan;Wang Junxi
主分类号	H01L21/00	IPC主分类号	H01L21/00;H01L27/15;H01L29/22;H01L33/06;H01L33/48;H01L33/62;H01L23/00;H01L33/00;H01L33/56;H01L33/58;H01L33/38
专利有效期	Packaging structure of light emitting diode and method of manufacturing the same 至Packaging structure of light emitting diode and method of manufacturing the same	法律状态
说明书摘要	The present disclosure relates to a light emitting diode packaging structure and the method of manufacturing the same. The light emitting diode packaging structure has an insulating substrate with through holes formed on each side of the upper surface thereof, the through hole being filled with conductive metal. Additionally, a n-type layer, an active layer, a p-type layer, an insulating layer and a p-type electrode are formed on the insulating substrate. The structure further may include a n-type electrode provided on a side of the upper surface of the n-type layer; a first back electrode provided at one side of the back surface of the insulating substrate; a second back electrode provided at the other side of back surface of the insulating substrate; and an optical element packaged on the base substrate.