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Method for manufacturing N-type MOSFET

  • 申请号:US201213878046
  • 专利类型:US
  • 申请(专利权)人:中国科学院微电子研究所
  • 公开(公开)号:US9029225(B2)
  • 公开(公开)日:2015.05.12
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专利详情

专利名称 Method for manufacturing N-type MOSFET
申请号 US201213878046 专利类型 US
公开(公告)号 US9029225(B2) 公开(授权)日 2015.05.12
申请(专利权)人 中国科学院微电子研究所 发明(设计)人 Xu Qiuxia;Zhu Huilong;Zhou Huajie;Xu Gaobo
主分类号 H01L21/336 IPC主分类号 H01L21/336;H01L21/28;H01L29/51;H01L29/49;H01L29/66
专利有效期 Method for manufacturing N-type MOSFET 至Method for manufacturing N-type MOSFET 法律状态
说明书摘要 The present disclosure discloses a method for manufacturing an N-type MOSFET, comprising: forming a part of the MOSFET on a semiconductor substrate, the part of the MOSFET comprising source/drain regions in the semiconductor substrate, a replacement gate stack between the source/drain regions above the semiconductor substrate, and a gate spacer surrounding the replacement gate stack; removing the replacement gate stack of the MOSFET to form a gate opening exposing a surface of the semiconductor substrate; forming an interface oxide layer on the exposed surface of the semiconductor; forming a high-K gate dielectric layer on the interface oxide layer in the gate opening; forming a first metal gate layer on the high-K gate dielectric layer; implanting dopant ions into the first metal gate layer; and performing annealing to cause the dopant ions to diffuse and accumulate at an upper interface between the high-K gate dielectric layer and the first metal gate layer and a lower interface between the high-K gate dielectric layer and the interface oxide layer, and also to generate electric dipoles by interfacial reaction at the lower interface between the high-K gate dielectric layer and the interface oxide layer.

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