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Flash devices and methods of manufacturing the same

  • 申请号:US201314403042
  • 专利类型:US
  • 申请(专利权)人:中国科学院微电子研究所
  • 公开(公开)号:US9287281(B2)
  • 公开(公开)日:2016.03.15
  • 法律状态:
  • 出售价格: 面议
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专利详情

专利名称 Flash devices and methods of manufacturing the same
申请号 US201314403042 专利类型 US
公开(公告)号 US9287281(B2) 公开(授权)日 2016.03.15
申请(专利权)人 中国科学院微电子研究所 发明(设计)人 Zhu Huilong
主分类号 H01L27/115 IPC主分类号 H01L27/115;H01L21/28;H01L29/788;H01L29/66;H01L29/78;H01L21/02;H01L21/033;H01L21/266;H01L29/10;H01L29/49
专利有效期 Flash devices and methods of manufacturing the same 至Flash devices and methods of manufacturing the same 法律状态
说明书摘要 Flash devices and methods of manufacturing the same are provided. The device may include: a semiconductor substrate, with a well region therein; a sandwich arrangement on the well region, including a back gate conductor, semiconductor fins on opposite sides of the back gate conductor, and back gate dielectric layers separating the back gate conductor from the respective semiconductor fins, wherein the well region serves as a part of a conductive path to the back gate conductor; a front gate stack intersecting the semiconductor fins, including a floating gate dielectric layer, a floating gate conductor, a control gate dielectric layer, and a control gate conductor stacked sequentially, wherein the floating gate dielectric layer separates the floating gate conductor from the semiconductor fins; an insulating cap on top of the back gate conductor and the semiconductor fins to separate the back gate conductor from the front gate stack; and source and drain regions connected to a channel region provided by each of the semiconductor fins. The device can achieve high integration and low power consumption.

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