Transistor and method for forming the same
- 申请号:US201113107860
- 专利类型:US
- 申请(专利权)人:中国科学院微电子研究所
- 公开(公开)号:US8952429(B2)
- 公开(公开)日:2015.02.10
- 法律状态:
- 出售价格: 面议 立即咨询
专利详情
专利名称 | Transistor and method for forming the same | ||
申请号 | US201113107860 | 专利类型 | US |
公开(公告)号 | US8952429(B2) | 公开(授权)日 | 2015.02.10 |
申请(专利权)人 | 中国科学院微电子研究所 | 发明(设计)人 | Yin Haizhou;Luo Zhijong;Zhu Huilong |
主分类号 | H01L29/772 | IPC主分类号 | H01L29/772;H01L21/265;H01L29/78;H01L29/417 |
专利有效期 | Transistor and method for forming the same 至Transistor and method for forming the same | 法律状态 | |
说明书摘要 | The present invention relates to a stress-enhanced transistor and a method for forming the same. The method for forming the transistor according to the present invention comprises the steps of forming a mask layer on a semiconductor substrate on which a gate has been formed, so that the mask layer covers the gate and the semiconductor substrate; patterning the mask layer so as to expose at least a portion of each of a source region and a drain region; amorphorizing the exposed portions of the source region and the drain region; removing the mask layer; and annealing the semiconductor substrate so that a dislocation is formed in the exposed portion of each of the source region and the drain region. |
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