专利详情

专利名称	Method for bonding two solid planes via surface assembling of active functional groups
申请号	US20060453067	专利类型	US
公开（公告）号	US2006289115	公开（授权）日	2006.12.28
申请（专利权）人	中国科学院长春应用化学研究所	发明（设计）人	ZHAO JIANYING (CN);QIU XUEPENG (CN);GAO LIANXUN (CN);BIAN ZHENG (CN)
主分类号	C04B37/00	IPC主分类号	C04B37/00
专利有效期	Method for bonding two solid planes via surface assembling of active functional groups 至Method for bonding two solid planes via surface assembling of active functional groups	法律状态
说明书摘要	The present invention belongs to a bonding technical field of biochips or micromechanical electrical devices, more specifically, to a novel method for bonding two solid planes containing silicon, oxygen, metal or other elements at a moderate temperature via surface assembling of active functional groups. The method includes the steps of: (1) cleaning and hydroxylating solid planes of silicon plate, quartz or glass; (2) aminating a hydroxylated surfaces of the substrate; (3) forming a mono-layer or multi-layer assembled film with compound monomers having an active bi-functional or multi-functional group on an aminated substrate surface; and (4) contacting two solid planes with a assembled film having the same or different active functional groups on its surface tightly, and forming covalent bonds at an appropriate temperature, pressure and a vacuum degree. Thus two solid planes are bonded with assembled films of bi-functional molecule or multi-functional molecule, thereby a bonding at molecular level of two solid planes are achieved.